Microwaves & RF Online: June, 2026

Check out the latest stories, videos, and podcasts from the month of June, 2026.
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July 1, 2026
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Welcome to Microwaves & RF's monthly publication, where you can find the latest articles, videos, and podcasts. You can sign up for our newsletters to see the latest articles as they're posted. You can also catch up on archived versions of MWRF's Top Stories of the Month.

David Maliniak
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Signal Reflections: What Were the Big Buzzwords at IMS 2026?

I’ve often wondered whether there are secret clubs, meetings, or chat rooms for marketing people. I wonder about this because when I roam around an exhibition hall such as this year’s International MTT-S Symposia (IMS 2026) and talk to a bunch of them, I invariably hear certain words repeatedly trotted out. The usual colloquialism for these oft-repeated words is “buzzword,” which the Merriam-Webster online dictionary defines as “an important-sounding, usually technical, word or phrase often of little meaning used chiefly to impress laymen.”

Read the rest of this Signal Reflections blog post

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Featured Content

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Ensuring reliable operation and communication for industrial equipment requires stable timing under harsh conditions to provide low latency and low jitter.
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For industrial environments, the decision between wired and wireless technology is a strategic engineering shift driven by physical deployment constraints.
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Ultra-wideband is rapidly becoming a foundational radio for industrial IoT because it adds precise, secure distance and location.
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While wireless connectivity technologies are now mature and widely deployed, powering large numbers of distributed RF devices remains a key challenge.
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Although quantum computers aren’t yet overcoming encryption at scale, that doesn’t mean the IoT sector can afford to wait.
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RF absorption and PLL phase calibration help phased-array subsystems reduce clock spurs while preserving spectral purity and channel coherency.
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Stay on top of the technologies and trends in focus at IMS 2026 and hear from industry insiders on the state of the wireless industry.
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Walk with Jack “Mr. Microwaves” Browne as he roamed the show floor at the recent IEEE International MTT Symposia in Boston.
Analog Devices
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A new simulation model approach called EM-Plug provides a practical path toward creating an accurate electromagnetic-based digital twin of an RF IC.

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New Products

Here are summaries of our new product coverage throughout the month.

Here's this week's selection of some of the most interesting new products that have been launched of late.
Here's this week's selection of some of the most interesting new products that have been launched of late.
Here's this week's selection of some of the most interesting new products that have been launched of late.
Here's this week's selection of some of the most interesting new products that have been launched of late.
Here's this week's selection of some of the most interesting new products that have been launched of late.

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Multimedia

Here are our latest videos and podcasts.

Electronic Design editors reveal what technologies and products stood out to them at the recent APEC 2026.
A novel technology can create nanoscale sensor structures up to 10X smaller than legacy MEMS sensor solutions.
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Microcontrollers can coordinate high-speed RF front ends to bring MHz-range measurement, automation, and signal processing into embedded workflows.
Manufacturing automation and robotics require precision and efficiency, both of which are enabled by IoT connectivity.

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Editor's Choice: From the Microwaves & RF Archives

These articles were chosen by the editors at Microwaves & RF to complement the new articles above. They're included in our regular newsletters.

An increase in 5G deployments will trigger a rise in complementary technologies that offer low-power flexibility, cost-effective power, and low-bandwidth options for massive Internet...
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Connector technology, born in the 1930s, must grow in capabilities and applications while shedding size and weight. Manufacturers that succeed in this market will be those looking...
EMI protection is a fundamental element of system design, but poor prioritization, unexpected sources of interference, or a lack of in-house answers can leave designers stumped...
Detailed real-world advice and demonstrations of multiple techniques on a sample microcontroller board can help you debug your power integrity problems fast.
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UWB can (and will) provide faster data rates and enhanced security for 5G applications.
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In 5G, non-terrestrial networks represent a plethora of connection scenarios from satellite-based communications via airborne stations, considering situations like air-to-ground...
Radar isn’t just for aircraft and self-driving cars. This article debunks some of the myths surrounding radar and reveals how radar is one of the essential sensors needed to enable...
Learn about the 12-term error model used to characterize systematic errors encountered during VNA measurements.
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mmWave technology's impact on 6G telecom
Though advances in 6G technology are still unfolding, the insights gained from achieving high performance and efficiency with 5G provides a roadmap for future innovations.
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Discover how artificial intelligence is revolutionizing spectrum operations, offering unparalleled speed, precision, and adaptability. AI will change the way we “see” RF.
The DoD’s Hardware/Software Convergence Initiative, an effort to develop a common modular hardware architecture across defense systems using OpenVPX as its basis, is now under...
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Learn how phase noise impacts a radar system’s performance and about a way to improve it using a voltage-controlled SAW oscillator in a PLL architecture.

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Editor's Monthly Picks

In this section, our editors highlight articles they found this month that you might be interested in as well.

Finwave’s newest RF switch additions deliver greater power handling, higher-frequency operation, and ultra-low insertion loss.
Anritsu's 5G RedCap application solutions streamline evaluation and wireless testing.
Saelig introduced EECL’s advanced EMI/RFI shielding techniques for custom form-in-place gaskets and microwave absorbers.
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U.S. Army soldiers in the Michigan National Guard have embraced a two-week training program to learn how to better use the smallest class of UAS drones on the modern battlefield...
U.S. Naval Research Laboratory
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Transfer of a transportable satellite tracking antenna system from Space Systems Command's System Delta 81 to the Blossom Point Tracking Facility boosts the lab’s space research...
Frenetic's magnetics design platform can explore and validate designs with high accuracy.
Pico Technology's latest ultra-low-noise PicoScope 5000E Series 16-bit oscilloscope offers precision and speed.
The high-isolation RF switches address next-generation wireless infrastructure, test and measurement, and automated test equipment systems.
The new portfolio offers TTL-compatible control that eliminates the need for negative voltage rails, simplifying biasing networks.
A new agreement between the U.S. DoW and Microsoft will provide software and services to the joint forces in a more unified fashion.
Infineon’s SECORA Connect X and SECORA Wallet brings secured contactless payment to smart wearables.
Small satellites such as SOAP and PANDORE are being developed to perform terrestrial Earth surveillance from space with the aid of X-band dynamic modulation.
Knightly Lab/Rice University
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Curved radio waves are being studied as a means of jamming interference.
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The Holomondas Optical Ground Station in Greece uses laser beams for high-speed communications to and from space.
Maritime uncrewed surface vehicles (USVs) will benefit from beyond LOS control with a communications system being jointly developed by Kymeta and Blue Ops.
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DropBlock communications units can be dropped by helicopter to forest firefighters for communications and personnel/equipment location information.
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The ESA unveiled the advanced design of an Earth observation satellite from Open Cosmos to boost data-collecting capabilities for Spain and Portugal.
SCD earned a multimillion-dollar contract for its SWIR and MWIR detectors for use in onboard compact satellite payloads.
Serving myriad applications, Pickering Interface’s signal-switching platforms can be preconfigured using a free online design tool.
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Offering high output power and gain for longer-range links, Altum RF’s E-band PAs and LNAs include on-chip integrated power detection.
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Advantech's AIW-411 Wi-Fi 6 + Bluetooth LE 5.4 wireless MCU module leverages the NXP RW612.
NI PXI Core Vector Signal Transceivers deliver calibrated, synchronized RF measurements for wireless, medical, and academic applications.
Networks International Corp.
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In time for nascent quantum-computing projects, NIC’s SMA-terminated diplexer shrugs off the –213°C temperatures required for quantum systems.
These high-reliability connectors are often used as JTAG connectors for testing board-level interconnects.
Cables and cable assemblies meet requirements for aerospace, space, medical, defense, and telecom applications.
DTCD and DTCJ 1.27-mm-pitch DIP switches will significantly reduce footprint without compromising functionality.

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About the Author

David Maliniak
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David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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