PAs and LNAs Poised to Support E-band Systems

Offering high output power and gain for longer-range links, Altum RF’s E-band PAs and LNAs include on-chip integrated power detection.

Altum RF will be at IMS (Booth #22020) to roll out its latest gallium-arsenide (GaAs) and gallium-nitride (GaN) MMICs for E-band applications. Intended for broad usage in the satcom, telecommunications, radar, and test and measurement markets, the power-amplifier and low-noise-amplifier MMICs support demanding mmWave applications with high output power and gain for longer-range links. These devices include an on-chip integrated power detector.

Some of the new offerings include:

  • ARF1221Q2: 6- to 18-GHz low-noise amplifier (LNA), 1-dB noise figure (NF), QFN package
  • ARF1224Q2: DC to 18-GHz LNA, 1.6-dB NF @ 10 GHz, QFN package
  • ARF1219Q2: 17.7- to 21.2-GHz LNA, 1.4-dB NF, QFN package
  • ARF1120Q3: 15- to 24-GHz driver amplifier, 22-dBm output P1dB, QFN package
  • ARF1121Q3: 27- to 31-GHz driver amplifier, 22-dBm output P1dB, QFN package
  • ARF1018: 71- to 79-GHz E-band power amplifier, 1.8-W Psat, bare die
  • ARF1019: 81- to 86-GHz E-band power amplifier, 1.6-W Psat, bare die
  • ARF1206: 71- to 86-GHz LNA, 2.5- to 3.5-dB NF from 71 to 86 GHz, bare die

More from IMS 2026

© Endeavor Business Media
signalreflectionspromo2
The International MTT Symposia descends on Boston in just a few short days. Here are some of the highlights you can plan for at the show.
Samtec
0626mwrf_samtec_ims_2026
These high-reliability connectors are often used as JTAG connectors for testing board-level interconnects.
EVM measurements
This new baseband vector signal transceiver (VST) comes on the heels of last year’s RF model, allowing for a complete wireless test solution.
Emerson NI
0626mwrf_emerson_ni_ims_2026_promo
NI PXI Core Vector Signal Transceivers deliver calibrated, synchronized RF measurements for wireless, medical, and academic applications.

About the Author

David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

Sign up for our eNewsletters
Get the latest news and updates