Master Bond formulates innovative, high quality epoxy adhesives, sealants, coatings and potting/encapsulation compounds for the RF and microwave industries. Each system is designed to meet specific application needs and requirements where electrical performance is critical. Compounds are formulated to be electrically conductive, thermally conductive and electrically insulative as needed. We also have formulations for effective shielding for EMI/RFI applications.
Certain products include fillers (such as graphite, nickel and silver) which are used to enhance a variety of performance properties including non-magnetic properties, electrical conductivity, EMI/RFI shielding, electro static discharge (ESD), resistance to thermal cycling, low stress, low volume resistivity and more.
Established in 1976, today Master Bond formulates over 3,000 grades of epoxies, silicones, UV cures and other specialty adhesive systems, in a variety of standard and specialty packaging. Our experienced application engineers provide individual support to help determine the best adhesive for your application.
