MasterBond epoxy

Epoxy Adhesives Enjoy Thermal Stability

March 20, 2018
A number of epoxy adhesives have passed MIL-STD-883J section 3.5.2 for material thermal stability.

A number of epoxy adhesives from MasterBond— notably EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT, and Supreme 12AOHT-LO—have passed MIL-STD-883J section 3.5.2 for material thermal stability. The testing indicates excellent thermal stability and consistent performance for these materials at operating temperatures to 200ºC.

MIL-STD-883 section 3.8.5 describes the thermal stability testing of these materials by means of thermogravitmetric analysis (TGA), according to ASTM D3850. The TGA is the study of a material’s weight change according to temperature and time under a controlled atmosphere, and can be used to determine the thermal stability of a material.

Evaluation of the material samples begins at room temperature in a nitrogen atmosphere. The samples are then heated at a rate of 10ºC per minute until a final temperature of 200ºC is reached. The material sample passes the testing if it is less than or equal to 1% of the cured material weight.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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