Master Bond formulates high quality, innovative adhesive systems for high-tech industries. Our goal is to help engineers meet specific requirements for their bonding, sealing ...
Master Bond EP62-1HTND is a two component epoxy system formulated for bonding and sealing applications requiring high temperature capability and chemical resistance, particularly...
Master Bond EP55TCFL is engineered for applications demanding efficient heat dissipation and electrical insulation. Its small particle filler enables thin bond lines, reducing...
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
Master Bond MasterSil 981-LO is a two-component silicone designed for high performance bonding, sealing, and encapsulating applications. It does not require air for curing. The...
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature...
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and...
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require ...
For over 50 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched...
Premier die attach epoxy EP3HTSDA-2 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This...
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing. Key Features Thermal conductivity exceeds 6...
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest...
