Materials & Packaging

Featured Companies

Mouser Electronics, Inc
Mouser Electronics is a globally authorized distributor of semiconductors and electronic components for over 1,100 industry-leading manufacturer brands.
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Master Bond
Master Bond formulates high quality, innovative adhesive systems for high-tech industries. Our goal is to help engineers meet specific requirements for their bonding, sealing ...

Featured Content

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Mouser Electronics and Parker Chomerics Announce Global Distribution Agreement
July 13, 2026 – Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic...
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UV16Med-FD
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
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Wakefield Thermal Hydro-Air Liquid-to-Air Heat Exchangers
Wakefield Thermal Hydro-Air Liquid-to-Air Heat Exchangers are designed for liquid-to-air thermal management in applications that demand strong heat transfer in a compact footprint...
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Sanyo Denki San Ace 40 9RA 40mm Low Noise DC Fans
Sanyo Denki San Ace 40 9RA 40mm Low Noise DC Fans deliver efficient, low-noise cooling for high-density equipment such as inverters, power supply units, and medical equipment....
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MasterSil 981-LO
Master Bond MasterSil 981-LO is a two-component silicone designed for high performance bonding, sealing, and encapsulating applications. It does not require air for curing. The...
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MasterSil 981-LO
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
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EP64
Two component, vacuum compatible epoxy with convenient handling featuring outstanding temperature and chemical resistance Key Features ·      ...
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EP64
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature...
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EP6STC-80
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
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EP6STC-80
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and...
Courtesy of Mouser Electronics, Inc.
Advanced Cooling and Power Solutions for High-Density AI Data Centers
Artificial intelligence (AI) has changed the physical reality of the data center. Training clusters and high-performance inference systems pack a significant number of graphics...
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UV26DCMed
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
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UV26DCMed
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require ...
About Master Bond
For over 50 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched...
Product Spotlight: EP3HTSDA-2
Premier die attach epoxy EP3HTSDA-2 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This...
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EP54TC
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing.   Key Features Thermal conductivity exceeds 6...

Latest Companies

Components Express
Meta Materials
Accumet Engineering
Bud Industries
Rogers Corp
West Bond Inc
Siefert Systems
Digi-Key
Digi Key Rgb
cirexx_international
Ohmega Ticer
ohmega_ticer
Amphenol Printed Circuits
Dow
The Occam Group
the_occam_group
Nuvotronics
nuvotronics
International Manufacturing Services
international_manufacturing_services
Advanced Assembly
Isola Group
Newark
ED2 Corp.
ed2_corp
Malico
Boston Micro Fabrication
Sunstone Circuits
Acm Research
Vulcan Wireless
vulcan_wireless
QML/MST
qml_mst
REMTEC
remtec
Trans-Tech
transtech
Tecdia
tecdia
Special Hermetic Products
special_hermetic_products
Garlock (an Enpro Company)
garlock
Wolfspeed
Greenerwave
Bot Factory
Ametek

Latest Content

How Do You Mix a Two Part Epoxy When Part B is a Powder
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EP54TC
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Supreme-10HTLV
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One Part 300°C Rated Silicone Passes Non-Cytotoxicity Standards
EP3HT-LO
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Master Bond UV15-7HP
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Master Bond EP29LPSPND-3
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Master Bond LED415DC90Med
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Master Bond EP53TC
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Master Bond Supreme 121AOND
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Master Bond EP21LSCL-2Med
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Master Bond EP3HT-LO
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Master Bond EP30HT-LO
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Master Bond UV11-3
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Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low Temperature Sterilization System
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Master Bond UV10TKLO-2
Master Bond
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment.
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Master Bond UV15RCL
Master Bond
UV23FLDC-80TK is a one component, UV and heat curable epoxy system with moderate viscosity that cures with good flexibility.
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Master Bond Polymer System EP21TDCS-LO