Materials & Packaging

Featured Companies

Courtesy Of Mouser Electronics, Inc
Mouser is a globally authorized distributor of semiconductors and electronic components for over 1,100 industry-leading manufacturer brands.
Courtesy of Master Bond
Master Bond
Master Bond formulates high quality, innovative adhesive systems for high-tech industries. Our goal is to help engineers meet specific requirements for their bonding, sealing ...

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Courtesy of Mouser
PEM BF™ & BFS™ Fine Finish Blind Nuts
PEM BF™ and BFS™ Fine Finish Self-Clinching Blind Nuts feature a bur-free design that delivers a cleaner conductive surface and higher dielectric breakdown margin.
Courtesy of Mouser
Advanced Thermal Solutions NVIDIA® Jetson Heat Sink Hardware Kits
Advanced Thermal Solutions NVIDIA® Jetson Heat Sink Hardware Kits ensure dependable thermal management, secure installation, and enhanced thermal interface performance for ATS...
Courtesy of Mouser Electronics, Inc.
Wakefield Thermal On-Chip Liquid Cold Plates
Wakefield Thermal On-Chip Liquid Cold Plates support Intel Xeon® processors and provide direct liquid cooling for high-power server CPUs in AI, HPC, and hyperscale data center...
Courtesy of Mouser Electronics, Inc.
Mouser Electronics and Parker Chomerics Announce Global Distribution Agreement
July 13, 2026 – Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic...
Courtesy of Master Bond
UV16Med-FD
Master Bond UV16Med-FD is a one part, low viscosity, epoxy based UV curable system containing a fluorescent dye for identification. This feature enables visual inspection with...
Courtesy of Mouser Electronics, Inc.
Wakefield Thermal Hydro-Air Liquid-to-Air Heat Exchangers
Wakefield Thermal Hydro-Air Liquid-to-Air Heat Exchangers are designed for liquid-to-air thermal management in applications that demand strong heat transfer in a compact footprint...
Courtesy of Mouser Electronics, Inc.
Sanyo Denki San Ace 40 9RA 40mm Low Noise DC Fans
Sanyo Denki San Ace 40 9RA 40mm Low Noise DC Fans deliver efficient, low-noise cooling for high-density equipment such as inverters, power supply units, and medical equipment....
Courtesy of Master Bond
MasterSil 981-LO
Master Bond MasterSil 981-LO is a two-component silicone designed for high performance bonding, sealing, and encapsulating applications. It does not require air for curing. The...
Courtesy of Master Bond
MasterSil 981-LO
Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for...
Courtesy of Master Bond
EP64
Two component, vacuum compatible epoxy with convenient handling featuring outstanding temperature and chemical resistance Key Features ·      ...
Courtesy of Master Bond
EP64
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature...
Courtesy of Master Bond
EP6STC-80
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Courtesy of Master Bond
EP6STC-80
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and...
Courtesy of Mouser Electronics, Inc.
Advanced Cooling and Power Solutions for High-Density AI Data Centers
Artificial intelligence (AI) has changed the physical reality of the data center. Training clusters and high-performance inference systems pack a significant number of graphics...
Courtesy of Master Bond
UV26DCMed
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Courtesy of Master Bond
UV26DCMed
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require ...

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