Wakefield Thermal On-Chip Liquid Cold Plates support Intel Xeon® processors and provide direct liquid cooling for high-power server CPUs in AI, HPC, and hyperscale data center environments.
The solution targets Intel Eagle Stream platforms and supports 4th and 5th Gen Intel Xeon Scalable processors, helping manage demanding thermal loads in dense compute racks. The Wakefield Thermal cold plates use an aluminum body with nickel plating and a vacuum-brazed construction. The design supports CPUs up to 700W TDP and delivers 0.0267°C/W thermal resistance under the listed test conditions, supporting sustained performance where air cooling may limit rack density.
