Products of the Week
Thermally Efficient Packages Protect ICs in Harsh Environs
June 9, 2023
Laminates, Prepreg Materials Lend Themselves to Higher-Frequency PCBs
June 8, 2023
Northrop Grumman Systems Corp.
DoD Invests in Hypersonic Systems
May 16, 2023
Transparent EMI Shielding Film Balances Transparency and Conductivity
Dec. 29, 2022
U.S. Department of Defense
DoD Tracks Down Beryllium for Webb Space Telescope
July 28, 2022
Material Evidence: How Laminate Properties Impact the PCB Design Process
July 11, 2022
Precision Au-Based Die-Attach Preforms Ensure High-Reliability Solder Joints
June 16, 2022
IC Packages Efficiently Disperse Heat in Myriad Applications
June 16, 2022
Rogers Debuts 3D-Printable Dielectrics and Laminates
June 14, 2022
At IMS2022, Rogers Corp. will be showcasing a new 3D-printable dielectric for use in gradient dielectric-constant (GRIN) structures as well as laminates for short-range industrial...
U.S. Dept. of Defense
DoD Forming Large 3D-Printed Buildings
April 20, 2022
Additive manufacturing and 3D printing are being used with a unique concrete material to erect training barracks for the U.S. Army.
MIT Lincoln Laboratory
3D Printing Shields Satellite Components
April 12, 2022
A custom print nozzle developed by MIT Lincoln Laboratory enables 3D printing of shielding materials directly on electronic components.
29019795 © Neil Lockhart | Dreamstime.com
Novel Material Challenges Legacy Audio Amplification
April 1, 2022
A breakthrough in materials science defies traditional electronics by doing away with them altogether in a range of audio apps.
Metasurface Enables High-Efficiency Harvesting of Ambient RF Energy
March 31, 2022
By constructing a resonant metamaterial antenna, researchers have captured and used a meaningful amount of ambient RF energy in the low-gigahertz range of the electromagnetic ...
Graphite Embedding Capability Furthers PCB Thermal Management
March 16, 2022
Purdue Assists AFRL in Building National Security
March 16, 2022
Optimizing PCBs for Best mmWave Filter Performance
Feb. 16, 2022
Solving 5G Ecosystem Challenges with Silicones
July 22, 2021
Wideonet | Dreamstime.com
Blink and You'll Miss 'Em: IMS 2021's MicroApps
June 1, 2021
Sometimes you want a whole meal, and sometimes just an appetizer. IMS 2021 aspires to provide the latter with short and snappy MicroApps tech presentations.
11 Myths About the PCB Industry
May 26, 2021
Today’s high-data-rate, high-frequency designs create new challenges for printed-circuit-board design.
Programmable THz-Wave Beamforming Surface Built from CMOS Tile Array
May 10, 2021
Using a tiled array of CMOS devices, a research team devised a metasurface that provides high-speed focusing and beamforming of terahertz waves.
IMS 2021 Prepares for mmWave Applications
April 30, 2021
Interest in components, circuit materials, and test solutions for millimeter-wave frequencies looms large as the RF/microwave industry readies for two versions of the annual IEEE...
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