Materials

Recent

Prom Osoldering Problems To Aviod Electronicdesign

Materials

Precision Au-Based Die-Attach Preforms Ensure High-Reliability Solder Joints

Highlights

Semiconductors

IC Packages Efficiently Disperse Heat in Myriad Applications

StratEdge’s post-fired and molded ceramic semiconductor packages meet critical needs in applications including telecom, VSAT, broadband wireless, defense, and more.

Materials

Rogers Debuts 3D-Printable Dielectrics and Laminates

At IMS2022, Rogers Corp. will be showcasing a new 3D-printable dielectric for use in gradient dielectric-constant (GRIN) structures as well as laminates for short-range industrial...

Defense

DoD Forming Large 3D-Printed Buildings

Additive manufacturing and 3D printing are being used with a unique concrete material to erect training barracks for the U.S. Army.

Defense

3D Printing Shields Satellite Components

A custom print nozzle developed by MIT Lincoln Laboratory enables 3D printing of shielding materials directly on electronic components.

Materials

Novel Material Challenges Legacy Audio Amplification

A breakthrough in materials science defies traditional electronics by doing away with them altogether in a range of audio apps.

Materials

Metasurface Enables High-Efficiency Harvesting of Ambient RF Energy

0322 Mw Teledyne Labtech Graphite Thermal Mgmt Promo

Defense

Graphite Embedding Capability Furthers PCB Thermal Management

Defense

Purdue Assists AFRL in Building National Security

Components

Optimizing PCBs for Best mmWave Filter Performance

Materials

Solving 5G Ecosystem Challenges with Silicones

Silicones have an attractive balance of properties, support high-volume manufacturing, and enable high-speed connections. They offer solutions to challenges with adhesion, encapsulation...

Systems

Blink and You'll Miss 'Em: IMS 2021's MicroApps

Sometimes you want a whole meal, and sometimes just an appetizer. IMS 2021 aspires to provide the latter with short and snappy MicroApps tech presentations.