This article is part of our IMS2022 coverage.
StratEdge will be in Booth 4089 at IMS2022 with its thermally efficient line of post-fired and molded ceramic semiconductor packages. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices fabricated in technologies such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.
StratEdge’s packaging products are manufactured to exacting specifications, using post-fired ceramics with features that are laser-cut to control tight tolerances, thermally enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. To further ensure optimized performance, StratEdge Assembly Services can package devices in the company’s new cleanroom, which is equipped with the latest precision wire bonding and die attach systems.
For more information, visit the company website.
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