StratEdge
Semiconductor Package Ims2022 62ab4d21ccddd

IC Packages Efficiently Disperse Heat in Myriad Applications

June 16, 2022
StratEdge’s post-fired and molded ceramic semiconductor packages meet critical needs in applications including telecom, VSAT, broadband wireless, defense, and more.

This article is part of our IMS2022 coverage.

StratEdge will be in Booth 4089 at IMS2022 with its thermally efficient line of post-fired and molded ceramic semiconductor packages. StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices fabricated in technologies such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and down-hole.

StratEdge’s packaging products are manufactured to exacting specifications, using post-fired ceramics with features that are laser-cut to control tight tolerances, thermally enhanced metal bases that dissipate heat, and electrical transition designs that provide exceptionally low electrical losses. To further ensure optimized performance, StratEdge Assembly Services can package devices in the company’s new cleanroom, which is equipped with the latest precision wire bonding and die attach systems.

For more information, visit the company website.

For more IMS2022 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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