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One-Part, Fast-Curing Epoxy Meets NASA Low-Outgassing Specifications

This adhesive cures with heat to polymerize within 5 to 10 minutes, bonding metals, glass, ceramics, composites, and many plastics. It’s serviceable over a wide temperature range for applications in aerospace, electronics, and optical use cases.

David Maliniak

Key Highlights

Single-component, non-premixed epoxy with an unlimited room temperature working life and quick heat curing in 5-10 minutes at 300°F.
Passes ASTM E595 low-outgassing tests, suitable for aerospace and microelectronics applications requiring minimal volatile emissions.
High mechanical strength with lap shear strength up to 1,800 psi and tensile strength up to 6,000 psi, ensuring durable bonds.

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Master Bond’s latest adhesive, EP3HT-LO, is a single-component, non-premixed and frozen, heat-cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests for NASA low outgassing, making it well-suited for use in the aerospace, electronics, microelectronics, and optical industries.

EP3HT-LO features a good strength profile, with a lap shear strength of 1,600 to 1,800 psi, a tensile strength of 5,000 to 6,000 psi, and a tensile modulus of 250,000 to 300,000 psi. It withstands 1,000 hours of 85°C/85% RH exposure.

This formulation offers reliable electrical insulation properties with a dielectric constant of 3.9 at 60 Hz and a volume resistivity of greater than 10¹⁴ Ω-cm at room temperature. It withstands a variety of chemicals such as water, oils, fuels, acids, and bases. This high-temperature-resistant system is serviceable from –60 to +400°F (–51 to 204°C).

As a one-part compound, EP3HT-LO offers convenient handling and processing. It cures with heat, quickly polymerizing in as little as 5 to 10 minutes at 300°F (~150°C). This epoxy bonds well to metals, glass, composites, ceramics, and many plastics. EP3HT-LO is available for use in half pints, pints, quarts, gallons, and syringes. Shelf life is six months at ambient temperatures in original, unopened containers.

About the Author

David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.