Emerson NI Unleashes High-Performance RF Test Systems for Cost-Sensitive Apps
Emerson’s NI business will be at IMS 2026 to debut the latest additions to its NI PXI Vector Signal Transceiver (VST) portfolio. These instruments are designed to get high-performance RF test technologies into cost-sensitive applications, including medical device development and electronic validation and production environments.
The new Core VST instruments — including the PXIe-5841 and PXIe-5820 — deliver calibrated, synchronized RF measurements in a modular platform optimized for speed, automation, and ease of use. By combining high-performance RF capability with a more accessible price point, the enhanced NI VST portfolio now enables more engineering teams to adopt advanced measurement techniques earlier in development. Then they can scale them up through production with consistency and efficiency.
The PXIe-5841 features 200-MHz instantaneous bandwidth and a fixed FPGA configuration, providing a streamlined option for fast, repeatable measurements. Alongside the PXIe-5820, these instruments integrate with the NI RFmx measurement software to deliver validated results in a simple, interactive environment that supports more efficient workflows from signal generation through analysis.
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David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.
