Insulated Wire Brings High-Reliability RF/Microwave Cables to IMS 2026
Insulated Wire Inc. will be at IMS (Booth #23077) with its lineup of extremely low-loss cables and assemblies, its Re-Flex hand-formable cable, and its high-RF-power coaxial cables. These products meet the requirements of a wide range of applications such as aerospace, space, medical, defense, and telecommunications.
At IMS, Insulated Wire features its 1-mm cable assemblies comprising a series of precision low-loss coaxial cables built for high-frequency applications up to 110 GHz. The assemblies rely on advanced material and design choices to deliver in applications requiring high precision and minimal signal loss.
Applications for the 1-mm cable assemblies include:
- High-frequency systems: Ideal for telecommunications, satellite communications, and radar systems requiring high bandwidth and precision.
- Test and measurement: Small diameter and millimeter-wave performance make the assemblies well-suited for probe station and vector-network-analyzer (VNA) test-port applications.
- Defense and aerospace: Suitable for inside-enclosure applications and high-density/multiport interconnect.
- Research and development: These cables are a valuable tool for innovative millimeter-wave research requiring the highest levels of signal integrity and performance.
At the Insulated Wire booth, pick up new-product brochures on high-power microwave products, the Re-Flex hand-formable cables, standard and custom wire products, and a short-form catalog.
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.
