Qorvo SOI RF Switches, Digital Attenuators to Debut at IMS 2026
Visit Booth #20036 at IMS 2026 to learn about Qorvo's new portfolio of silicon-on-insulator (SOI) RF switches and digital step attenuators (DSAs). These devices, designed for defense, aerospace, and infrastructure applications, simplify RF system design, reduce BOM complexity, and accelerate integration in wideband systems.
These solutions address growing system demands for broader frequency coverage, agile signal routing, and simplified integration without the complexity of legacy GaAs-based, RF-control-component approaches or multi-vendor RF control chains.
With TTL-compatible control that eliminates the need for a negative voltage rail, Qorvo’s SOI portfolio helps designers simplify biasing networks, reduce BOM count, and streamline board layouts while maintaining the fast-switching speeds, high isolation, and high linearity required in defense and aerospace applications. The portfolio gives designers a simpler alternative to legacy RF control approaches that require negative bias rails, multiple control components, and more complex board-level integration.
Included in the portfolio are the following products:
- QPC2320: Reflective SPDT switch (up to 15 GHz) with low insertion loss, high isolation, high linearity, and <50-ns switching for radar, electronic-warfare (EW), and secure-comms applications.
- QPC2420: This reflective SPDT switch ranges up to 30 GHz for wideband coverage in a compact footprint for wideband radar, satcom, and test and measurement applications.
- QPC2180: Reflective SP8T switch (up to 8 GHz) with high linearity for filter banks and multiband radios.
- QPC5330: 6-bit DSA (up to 15 GHz) with precise attenuation, glitch-safe operation, and SPI/I2C control in signal-conditioning and radar/EW applications.
- QPC5430: This 6-bit DSA extends the frequency range to 30 GHz for test and measurement, mmWave backhaul, and communications systems.
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.
