Microwaves & RF Monthly: May, 2026
Welcome to Microwaves & RF's monthly publication where you can find the latest articles, videos, and podcasts. You can sign up for our newsletters to see the latest articles as they're posted. You can also catch up on archived versions of MWRF's Top Stories of the Month.
Signal Reflections: What to Look For at IMS 2026
If there’s a sure sign of spring (other than bad New York Mets baseball), it’s the arrival of the wireless industry’s premier gathering: the IEEE International MTT Symposia (IMS). 2026’s Microwave Week takes place at Boston’s Thomas M. Menino Convention & Exhibition Center (MCEC) from June 7 to 12. Let me give you a brief rundown of some of the goings-on at the event.
Editor's Choice: From the Microwaves & RF Archives
These articles were chosen by the editors at Microwaves & RF to complement the new articles above. They're included in our regular newsletters.
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.
About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.
