Small Cable-to-Board Connectors Target High-Vibration Environments
Samtec's SMPM cable-to-board Precision RF connector family has grown to include small-form-factor, threaded cable-to-board mated sets. Featuring a threaded SMPM MIL-STD-348 interface with a retractable threaded coupling nut, these connector assemblies are well-suited for use in high-vibration environments such as military, aerospace, and communication applications.
High-vibration environments can exceed the retention capabilities of traditional push-on RF interconnects. Designed with enhanced mechanical strength that provides a secure and robust connection, Samtec’s threaded SMPM cable-to-board mated connector sets include the RF047-A and RF086 millimeter-wave, low-loss cable assembly families. They handle up to 67 GHz as well as SMPMT threaded, SMPM millimeter-wave board-mount plugs available up to 60 GHz.
Some key features of the new Precision RF family members include a full detent or smooth bore for varying retention forces. The SMPMT connector’s voltage standing-wave ratio (VSWR) is 1.35:1 typical from 26.5 to 40 GHz. The low-loss flexible mmWave cables come in 0.047- or 0.086-in. diameters. Mixed-technology board termination provides resistance to mechanical stress and supports high frequencies.
In addition, Samtec offers a wide variety of end options for blending application-specific customization with the simplicity and lead-time efficiencies of standard off-the-shelf solutions.
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David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.