Scalable RF/Microwave Signal Switches are Backed by Graphical Design Tool
At IMS 2026, Pickering Interfaces (Booth #14104) plans to display its COTS, configurable, and turnkey signal-switching platforms in support of scalable RF and microwave test systems. These platforms, fashioned in compliance with PXI and LXI standards, serve applications from aerospace and defense to communications, semiconductor, and automotive test.
The company will also demo its Microwave Switch Design Tool, part of the company’s recently released Test System Architect graphical toolset. The free online tool enables engineers to graphically design, configure, and simulate RF and microwave switching systems, specify components such as relays, attenuators, connectors, and cables, and share designs with colleagues or Pickering engineers for evaluation before manufacturing.
At IMS, Pickering will highlight its RF & microwave switching solutions, including:
- Standard COTS RF and microwave switching solutions: PXI and PXIe modules with bandwidths up to 110 GHz, including SPDT, transfer, multiplexer, and matrix options, supported by PXI, PXIe, and LXI/USB chassis.
- Flexible RFIU switch platforms: User-specified microwave switching solutions available in PXI and LXI formats, supporting high-performance microwave relays up to 110 GHz at 50-Ω impedance and up to 2.5 GHz at 75-Ω impedance, with a range of front-panel connector options.
- Turnkey RFIU switch and signal routing subsystems: Custom LXI microwave switch subsystems designed to meet unique test requirements while supporting long-term system compatibility.
Also featured will be solutions from the company’s reed relay and connectivity divisions.
More from IMS 2026
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.
About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.






