Top Stories: March 2026

Here are some of the latest stories, videos, and podcasts from the month of March, 2026.
April 2, 2026

Here's a selection of this month's articles on Microwaves & RF. Keep checking back as more content is added during the month. Take a look at the latest newsletters. You can also visit archived versions of Top Stories


Featured Content

ID 122085436 © Alexandersikov | Dreamstime.com
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The Internet of Things has made our lives more connected and automated than ever before, with accelerated adoption across homes, buildings, and industrial environments.
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As IoT 2.0 brings edge AI, real-time coordination, and constant data streams into residential environments, the challenge becomes the creation of a scalable, secure wireless foundation...
ID 53546193 © Audioundwerbung | Dreamstime.com
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Intelligent controllers are moving security and access decision-making from centralized servers to the edge of the network, right to the door.
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Maintaining phase consistency across RF cable assemblies is essential for multichannel, high-frequency systems. This article outlines a practical approach to defining and controlling...
ID 78362079 © Tashatuvango | Dreamstime.com
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When it comes to design engineering, the need to know more is ever-present. How has our audience fared in terms of staying current? Find out from our 2025 Annual Salary and Career...
ID 56604947 © Haiyin | Dreamstime.com
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Many households now support more than 50 wireless devices, making it challenging to ensure a consistent user experience.
ID 71562940 © Vladimir Stanisic | Dreamstime.com
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This article explores the real-world RF challenges of coexistence, antenna integration, and enclosure interaction, and outlines a practical design approach for delivering reliable...
Texas Instruments
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Thanks to these new MCUs with the TinyEngine NPU, edge-based applications of AI acceleration can make consumer devices more intelligent and industrial devices more efficient.

Multimedia

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Artificial intelligence is a logical progression in edge computing and automated testing. However, it’s important to understand how best to deploy AI in a system.
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Find out how to do AI processing of multiple video streams locally.
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Economic development is more than just creating a great product or service — it also involves establishing a base of operations and setting up logistics.
Cinch Connectivity
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When deploying connectors engineered to perform in extreme temperatures and harsh environments, it’s important to understand customer needs to deliver tailored solutions.

More of This Month's Articles

Direct Insight
Direct Insight's QSMP-15W module adds wireless connectivity to the STM32MP1 MPU platform for IoT & Industry 4.0 applications.
The QFN-style system-on-module adds Wi-Fi and Bluetooth to Arm Cortex-A7 + Cortex-M4 architecture to support a diverse range of embedded applications.
Mission Microwave
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This SSPA pumps out 750 W from 13.75 to 14.50 GHz in satellite-communications applications.
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The Renesas MCU Clicker 4 dev board from MIKROE offers a wide variety of sensor and communication modules.
The Renesas MCU Clicker 4 development board from MIKROE offers a wide range of sensor and communication modules.
NXP
NXP's Third-Generation Radar Transceiver Delivers High-Performance Imaging Radar for Level 2+ to Level 4 Autonomous Driving.
NXP's third-generation radar transceiver delivers high-performance imaging radar for Level 2+ to Level 4 autonomous driving.
iRocket
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Testing of an iRX-100 2.75-in. missile from iRocket equipped with an Arnold Defense launcher demonstrated speeds to Mach 2 at a distance of 6 km.
Menlo Micro | Generated by AI
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A MEMS-based commercial switch/multiplexer from Menlo Micro helped reduce the bottlenecks typical of quantum computers when mating cryogenic hardware to room-temperature components...
Rohde & Schwarz
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The acquisition puts Rohde & Schwarz in position to support the growth of the satcom industry and to look ahead to 6G.
Open Cosmos
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ConnectedCosmos is a LEO-based satellite constellation launched to provide space-based communications at available K-band frequencies.
Saelig
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This battery-powered, 2.4-GHz ISM-band transceiver uses DSSS modulation to achieve a wireless communications range as great as 300 m.
STMicroelectronics
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STMicroelectronics’ single-chip buck converter packs 3 A of power for appliances and industrial loads.
TASKING
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The enhanced TASKING integrated toolchain combines compile, debug, and test capabilities to automate the measurement, assessment, and optimization of hidden timing interference...
STMicroelectronics
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ST’s ST64UWB family of SoCs supports the 802.15.4z and upcoming 802.15.4ab UWB standard with multi-millisecond ranging (MMS), including narrowband assistance radio (NBA).
Dreamstime_carloscaetano_31188634 and Cortec
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Cortec helps automakers and electronics manufacturers meet environmental packaging targets with VCI paper bags.
ARIA SENSING
ARIA SENSING and ALGORIZED Unveil an AI-Powered UWB Radar for Next-Generation Automotive Child Presence Detection.
ARIA Sensing and Algorized unveil an AI-powered UWB radar for next-generation automotive child presence detection.

About the Author

David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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