72nd IEDM Unveils ICs for Intelligence

San Francisco and the Union Square Hotel will be home to the 72nd annual IEEE IEDM, one of the most important and influential technical events for members of the semiconductor and microelectronics industries.

The 72nd edition of the annual IEEE International Electron Devices Meeting (IEDM) is scheduled for December 12-16, 2026, in the Hilton San Francisco Union Square Hotel (see image above). This year’s theme, “Devices at the Heart of the Intelligence Revolution,” highlights the semiconductor devices and microelectronic technologies making strong growth of artificial intelligence (AI) possible.

The technical program will include 280 presentations as well as Focus Sessions (including several on quantum computing), tutorials, short sources, and a supplier exhibition. 

Pointing out how semiconductor devices and microelectronic technologies are being applied to AI, 2026 IEDM Publicity Chair, John Paul Strachan (Director of Peter Grünberg Institute, Forschungszentrum Jülich, and Professor at RWTH Aachen University, Germany), said, “We are seeing again many efforts across industry and research teams to especially address the unique challenges posed by AI. This spans memory performance and density, including 3D developments, logic technology, and more emerging approaches with 2D materials and in-memory computing.”

Strachan added, “System-level integration is also front and center. While these traditional computing paradigms continue to progress, IEDM also has its eyes on future technologies such as quantum computing.”

Sandy Liao, IEDM 2026 Publicity Co-Chair and Director at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), explained, “The defining trend of the year is that technological breakthroughs are no longer limited to individual devices or isolated fields.”

Regarding progress in semiconductors and microelectronics, Liao said, “Progress increasingly depends on co-optimizing materials, transistor architectures, memory, interconnects, and packaging as an integrated system. The breadth of work at IEDM 2026 shows how the semiconductor community is redefining scaling for the intelligent-computing era.”

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About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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