Purdue University
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Purdue Teams with IMEC for Semiconductor Growth

May 18, 2023
Purdue University President Mung Chiang joined local politicians in Washington, DC to announce a partnership between the school and IMEC for the advancement of semiconductor technology.

Purdue University recently announced a partnership with the Belgium-based Interversity Microelectronics Centre (IMEC) to foster the advancement of semiconductor nano and digital technology.

Mung Chiang, President of Purdue University, joined Indiana Governor Eric Holcomb, U.S. Senator Todd Young, and Indiana Secretary of Commerce Brad Chambers in announcing the partnership during the SelectUSA Investment Summit in Washington, DC (see image above). IMEC is often referred to as a “lab-to-fab” facility for its tendency to develop practical semiconductor technologies, which can be mass-produced in commercial-grade foundries.

Chiang beamed his enthusiasm for Purdue’s place in semiconductor development. “Purdue University and the state of Indiana have become the heart of the silicon heartland. Purdue is the most visible and forward-leaning university in the U.S. in the semiconductor degrees program, in research innovation to rewrite the economic equation of on-shoring fabs and packaging, in industry partnership with over 20 leading companies, and in national leadership in CHIPS for America’s execution.”

Regarding IMEC, he added, "We warmly welcome the IMEC ecosystem to the home of America’s top four engineering and top five patent-receiving universities.”

Mark Lundstrom, Purdue’s chief semiconductor officer and senior advisor to the university president, has acknowledged the university’s aggressive stance in global semiconductor technology. “Future-focused partnerships like this help bring together world-class expertise and state-of-the-art facilities.”

IMEC offers research sites across Belgium with efforts in various semiconductor processes as well as artificial-intelligence (AI) devices. The collaboration will provide a steady exchange of expertise among students, faculty, and semiconductor professionals in the field.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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