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    Highlights

    Teledyne e2v Semiconductors
    Teledyne e2v's LX2160 CPU comes in upscreened version
    The latest upscreened version of the model LX2160 microprocessor provides impressive computing power across a wide temperature range in a package measuring just 40 × 40 mm.
    William Wong | Electronic Design
    April 12, 2024
    NXP’s CoreRide Platform introduces the S32N system-on-chip family that's integrated with third-party software.
    April 12, 2024
    Ambiq’s Cortex-M55-based Apollo510 microcontroller builds on its SPOT technology.
    Intel
    April 12, 2024
    The mid-range Agilex 5 developed by Intel incorporates AI acceleration and long-term support for applications from medical to robotics.
    Embedded World
    April 9, 2024
    Here are some highlights we've discovered while traversing the exhibit floor this week in Nuremberg.
    Arm
    April 4, 2024
    The new Arm ecosystem can develop software on virtual-prototyping solutions ahead of physical silicon being available.
    March 19, 2024
    Learn how NXP leverages MicroEJ’s software containers with standard APIs to bring software portability to a broad range of NXP’s RTOS-based MCUs and Linux-based processors.
    Purdue University
    Demay5 2 Promo
    Purdue University President Mung Chiang joined local politicians in Washington, DC to announce a partnership between the school and IMEC for the advancement of semiconductor technology...
    Ces Nx Psoftware
    NXP's i.MX 95 features the eIQ Neutron NPU with up to six Cortex-A55s in the application domain, a M7, and an M33 in two separate lower-power safety domain islands that can be...
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