Chip-Scale Atomic Clocks Serve Low-Power and Remote Duties

In a video demonstration, Microchip Technology’s chip-scale atomic clocks reveal their low phase noise and application versatility.
Oct. 9, 2025
3 min read

What you'll learn:

  • Microchip’s CSACs are designed for high accuracy in extreme environments such as space and deep-sea applications.
  • Different models, including space-grade and low-noise versions, cater to diverse precision timing needs.
  • Phase-noise analysis with the 53100A demonstrates the devices’ high frequency stability, with phase noise around –85 dBc/Hz at 1 Hz.
  • TimeLab software enables detailed data acquisition, editing, and visualization of frequency-stability and phase-noise measurements.
  • Clockstudio provides real-time device status updates, including temperature and operational health, essential for deployment in specific temperature profiles.

When executing system designs, there will inevitably be instances in which one requires extremely accurate clocking in battery-powered and/or remote use cases. It might be something like, say, remote sensing from an ocean floor, or space-borne systems.

One solution for such requirements is Microchip Technology’s chip-scale atomic clock devices (CSACs), which tolerate a wide range of operating temperatures, offer fast warmup, and provide high-frequency stability in harsh environments.

In a recent demo of these devices, Microchip engineers showed off the capabilities of its devices, of which there are several versions. These include one meant for space applications and a low-noise version (LN-CSAC). There’s also a rubidium oscillator that Microchip calls its Miniature Atomic Clock (MAC). The MAC represents a tradeoff between low power and high performance.

In the demo, engineers used a Microchip Technology 53100A phase-noise analyzer. It's designed to measure the amplitude, phase, and frequency stability of high-performance oscillators, crystal oscillators, atomic clocks, MEMS oscillators, or anything that can produce a frequency between 1 and 200 MHz.

Rather than relying on a reference clock input, the 53100A contains an internal reference oscillator for comparison against the DUT. The demo also featured TimeLab software, which supports the acquisition, editing, transforming, and display of data from several instruments, including the 53100A.

The TimeLab software generates Allan deviation plots, which provide a measure of frequency stability in clocks and oscillators. In this case, the plot shows frequency stability for the chip-scale atomic clock across various time periods. Toggling is allowed between frequency-stability measurements and phase-noise measurements. The demo shows the CSAC to have phase noise of about –85 dBc/Hz at 1 Hz.

The demo concludes with another (free) software tool, Clockstudio, which communicates directly with a CSAC, MAC, or LN-CSAC. This free tool unearths lots of information about the DUT, such as the serial number and hardware version, and provides links to product web pages, user guides, datasheets, and more.

Clockstudio also reads out key information about the device’s operational status, such as the device’s temperature. That measurement would be vital if you plan to deploy the device in a specific temperature profile.

Related links:

Chip-Scale Atomic Clocks

53100A phase-noise test set

TimeLab software

Clockstudio software

In executing system designs, there will be instances in which one requires extremely accurate clocking in battery-powered and/or remote use cases. It might be something like, say, remote sensing from an ocean floor, or space-borne systems. One solution for such requirements is @MicrochipTechnology's chip-scale atomic clock devices (CSACs), which tolerate a wide range of operating temperatures, offer fast warmup, and provide high frequency stability in harsh environments.

About the Author

David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

Sign Up for MWRF Newsletters
Get the latest news and updates.