68b9e002293707ba69ef06bb Ums Amplifier Promo

High-Power GaN-on-SiC Amplifier Targets VSATs, Uplinks, 5G, and More

Sept. 4, 2025

UMS’s latest bare-die amplifier covers 27 to 31 GHz and provides 5 W of saturated output, yielding 23% and 24 dB of gain.

David Maliniak

Related To:

Microwaves & RF

United Monolithic Semiconductor (UMS) has dropped the latest in its family of high-power amplifiers —the CHA6357-98F, which covers 27 to 31 GHz. The bare-die, three-stage GaN device’s 5-W saturated output power translates to 23% and 24 dB of gain.

With applications in very-small-aperture terminal (VSAT) networks, satellite uplinks, 5G, and other radio-link scenarios, the amplifier delivers 33 dBm of linear power (37-dBm power output with +14 dBm of input power). It also offers an adjacent-channel power ratio of –30 dBc and is highly linear with low power consumption when operated with output power back-off enabled. The latter makes the device useful as a driver for downstream high-power amplifiers.

Other features of the CHA6357-98F include internal matching to 50 Ω at both the input and output, an integrated output-power detector, and ESD RF protection. The 2.5- × 1.6-mm² die is manufactured on a robust GaN-on-SiC HEMT process.

Learn more about RF amplifiers

Mwrf Com Sites Mwrf com Files Uploads 2016 01 Figure 01 1

Ensure Stability In Amplifier Designs

Aug. 27, 2004

11 Myths About GaN

April 22, 2020

GaN-on-Si Semiconductors Compete with GaN-on-SiC

July 16, 2025

RF Amplifier Design

May 4, 2023

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.