The 2018 IEEE International Microwave Symposium (IMS) showcased the industry’s latest innovations, and offered vignettes of its past achievements.
The trend throughout the high-frequency industry is to design passive components that can handle higher power levels with effective thermal management in tighter spaces
These companies used IMS 2018 as an opportunity to unveil the latest monolithic microwave integrated circuits (MMICs) to satisfy the needs of designers everywhere.
Suppliers of interconnect products were in full force at IMS 2018, demonstrating new solutions to “connect” all the pieces together in RF/microwave applications.
The following is a small visual sampling of some of the activity at IMS 2018, which took place in Philadelphia, PA from June 10-15.
IMS 2018 showcased the latest in high-power RF capability, with multiple companies demonstrating an array of performance breakthroughs.
New laws are calling for the dependable tracking of firearms, and modern RFID tags can be integrated with the metal components of firearms to monitor the use of guns.
This latest blog post in the series presents a workflow that can be utilized for nonlinear power-amplifier (PA) characterization.
Due to its more advanced technology, non-standalone (NSA) 5G New Radio will require different antenna requirements than those of 4G LTE systems.
MACOM unveiled its broadband power detector with a wide dynamic range spanning −15 to +15 dBm from 5 to 44 GHz.