SV Microwave
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Interconnect Range Serves Rugged Mil/Aero Systems

June 12, 2025
Connectors for VITA 67.3 embedded systems, blind-mate RF adapters, and torque-resistant edge launch connectors are among highlights.

Browse our complete IMS 2025 coverage.

SV Microwave will showcase its latest interconnect product lines in the Amphenol Corridor (Booth #1127) at IMS 2025. Among them is the company’s NanoRF VITA 67.3 connector system, which is designed for high-density, high-frequency modular embedded systems. The connectors support OpenVPX architectures and SOSA-aligned platforms, featuring rugged blind-mate interfaces that range up to 70 GHz in harsh environments.

The company’s BMB RF adapters also support blind-mate interfaces, such as high-power use cases that are troublesome for traditional push-on connectors. These adapters conform to MIL-STD-348 and provide high durability and power handling at up to 22 GHz. They’re suited for defense and aerospace applications thanks to their compatibility with D38999 panel-mount connectors.

Also featured at IMS is the company’s lineup of torque-resistant edge launch connectors, which improve connector-to-PCB reliability. Operating at up to 65 GHz, these connectors minimize damage to contacts and PCB traces during mate/demate cycles.  

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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