Anokiwave Ims 6481e3bbe6111

mmWave ICs Enable Active Antennas in 5G and Satcom Applications

June 8, 2023
Anokiwave's devices help network operators more quickly implement mmWave 5G radios for every 3GPP FR2 band, and point satellite-communications designers toward successful deployments.

This article is part of our IMS 2023 coverage.

In IMS Booth 2148, Anokiwave presents its portfolio of mmW silicon ICs that enable active antennas across multiple markets, specifically 5G, satellite communications, and aerospace and defense.

Some of the highlights of Anokiwave’s IMS 2023 display include:

  • The full release of the company’s 4th-generation multi-band silicon 5G IC family that covers 24 to 43.5 GHz. The new IC family helps network operators accelerate their builds of energy-efficient, low-cost, and small-form-factor mmWave 5G radios for every 3GPP FR2 band.
  • Anokiwave’s Ku- and Ka-band ICs, which are used in multiple terminal designs operating live satellite links globally. Thanks to the ICs’ performance, cost-effectiveness, and availability in volume, customers can successfully design, build, and deploy satellite-communication systems.
  • At the Connected Future Summit, to be held on June 13, Ryan Jennings, Anokiwave's VP of SATCOM and Systems, will discuss ways in which satellilte communications will play a key part in extending terrestrial 5G networks to air, sea, and other remote areas not covered by small-cell networks. He'll also delve into why active antennas are uniquely suited for this growth area.

Anokiwave’s large portfolio of mmWave ICs is shipping in volume and commercially deployed in working antennas.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form. 

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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