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Otava Shows Off Microwave/mmWave ICs and SoCs

June 12, 2023
Digitally tunable filters, a mmWave radio development kit, and an active phased-array antenna module will be demonstrated in Otava’s and partners’ booths at IMS.

This article is part of our IMS 2023 coverage.

Visit IMS Booth 2514 to catch up with Otava Inc., which designs and manufactures wideband microwave and mmWave ICs and SoCs for 5G, satellite communications, and defense applications. Among the demonstrations in Otava’s booth will be their digitally tunable filters. Otava’s OTFL301 is a 24- to 40-GHz bandpass filter comprising a single-chip replacement for discrete filter banks and cavity-tuned filters. Its footprint is 10X smaller, a fraction of the size, and it's much lighter and draws minimal current.

Otava will also be taking part in demos in partners’ booths. For example, in MathWorks’ Booth 2541, you can get a look at a wideband mmWave radio-development kit for AMD’s RFSoC Gen 3. Designed in collaboration with Avnet, the kit combines the Otava DTRX2 20- to 30-GHz, dual-transceiver radio card with the AMD Xilinx Zynq UltraScale+ RFSoC to let designers explore the entire signal chain from RF to IF sampling.

Meanwhile, in Samtec’s Booth 2627, you can view Otava’s 64-element, 24- to 30-GHz active phased-array antenna module, which includes beamformers as well as 64 vertical and 64 horizontal antenna elements in a package measuring just 6.5 × 13.5 × 4.5 in.

For more information, visit the company's website.

For more IMS 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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