One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Digi Connect® Sensor XRT-M provides a versatile solution for remote monitoring and implements Digi Axess. Digi Axess delivers the flexibility of the cloud and seamlessly...
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing. Key Features Thermal conductivity exceeds 6...
A MEMS-based commercial switch/multiplexer from Menlo Micro helped reduce the bottlenecks typical of quantum computers when mating cryogenic hardware to room-temperature components...
The enhanced TASKING integrated toolchain combines compile, debug, and test capabilities to automate the measurement, assessment, and optimization of hidden timing interference...
ST’s ST64UWB family of SoCs supports the 802.15.4z and upcoming 802.15.4ab UWB standard with multi-millisecond ranging (MMS), including narrowband assistance radio (NBA).
Thanks to these new MCUs with the TinyEngine NPU, edge-based applications of AI acceleration can make consumer devices more intelligent and industrial devices more efficient.