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Featured Products

Courtesy of Master Bond
EP64
Two component, vacuum compatible epoxy with convenient handling featuring outstanding temperature and chemical resistance Key Features ·      ...
Courtesy of Master Bond
EP6STC-80
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Courtesy of Mouser Electronics, Inc.
Digi Connect® Sensor XRT-M
Digi Connect® Sensor XRT-M provides a versatile solution for remote monitoring and implements Digi Axess. Digi Axess delivers the flexibility of the cloud and seamlessly...
Courtesy of Master Bond
UV26DCMed
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Courtesy of Master Bond
EP54TC
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing.   Key Features Thermal conductivity exceeds 6...

Latest Products

Saelig
Saelig's Micsig AHO01 High-Resolution 200MHz Automotive Oscilloscope.
Saelig's Micsig AHO01 high-resolution 200-MHz automotive oscilloscopes handle both ICE and new energy vehicle diagnostics.
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New Monolithic GaN converters from STMicroelectronics help boost energy savings in a wide range of applications.
ROHM
ROHM launches an Ultra-Compact Wireless Power Chipset for Wearables.
ROHM's power-supply IC chipset is compatible with NFC technology for small wearables.
Rohde & Schwarz
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New additions to the R&S BBA300 family deliver 500 W and 1,000 W from 1 to 6 GHz.
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The fixed 7,000-MHz oscillator keeps noise down to -106 dBc/Hz at 10-kHz offset to provide a clean signal in high-sensitivity designs.
Bosch
Bosch presents ultrasonic chipsets for AI-based applications in the automotive industry.
Improved signal quality enables Bosch's new ultrasonic chips to make more accurate AI-based decisions in parking and driving situations.
Anritsu
Anritsu and LG validate in-vehicle system for Hybrid eCall certification.
Anritsu and LG Electronics validated LG’s in-vehicle system for Hybrid eCall operation.
Embedder
Embedder’s AI platform grounds AI agents by using hardware-specific documentation.
Embedder’s AI platform grounds AI agents, providing a production-ready platform to automate code generation, IP security, and hardware verification on leading silicon ecosystems...
Kymeta Government & Defense
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Kymeta’s KuKa Series multiband antennas and terminals bring dependable satcom links to U.S. Navy maritime operations even in rough waters.
Menlo Microsystems
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Completing Task 4 of the U.S. Navy’s 10-MW Advanced Circuit Breaker Development Program, Menlo Micro has demonstrated the capability and reliability of its high-power switching...
LYNRED
LYNRED's ARGO SL compact Infrared detector for drones.
A turnkey mid-wave infrared module enables high-performance thermal imaging for tactical drones and other applications.
congatec
A range of congatec modules supports computationally powerful, energy-efficient embedded AI applications.
New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.