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Featured Products

Courtesy of Master Bond
EP6STC-80
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Courtesy of Mouser Electronics, Inc.
Digi Connect® Sensor XRT-M
Digi Connect® Sensor XRT-M provides a versatile solution for remote monitoring and implements Digi Axess. Digi Axess delivers the flexibility of the cloud and seamlessly...
Courtesy of Master Bond
UV26DCMed
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Courtesy of Master Bond
EP54TC
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing.   Key Features Thermal conductivity exceeds 6...

Latest Products

Mission Microwave
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This SSPA pumps out 750 W from 13.75 to 14.50 GHz in satellite-communications applications.
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The Renesas MCU Clicker 4 dev board from MIKROE offers a wide variety of sensor and communication modules.
The Renesas MCU Clicker 4 development board from MIKROE offers a wide range of sensor and communication modules.
NXP
NXP's Third-Generation Radar Transceiver Delivers High-Performance Imaging Radar for Level 2+ to Level 4 Autonomous Driving.
NXP's third-generation radar transceiver delivers high-performance imaging radar for Level 2+ to Level 4 autonomous driving.
Menlo Micro | Generated by AI
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A MEMS-based commercial switch/multiplexer from Menlo Micro helped reduce the bottlenecks typical of quantum computers when mating cryogenic hardware to room-temperature components...
Saelig
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This battery-powered, 2.4-GHz ISM-band transceiver uses DSSS modulation to achieve a wireless communications range as great as 300 m.
STMicroelectronics
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STMicroelectronics’ single-chip buck converter packs 3 A of power for appliances and industrial loads.
TASKING
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The enhanced TASKING integrated toolchain combines compile, debug, and test capabilities to automate the measurement, assessment, and optimization of hidden timing interference...
STMicroelectronics
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ST’s ST64UWB family of SoCs supports the 802.15.4z and upcoming 802.15.4ab UWB standard with multi-millisecond ranging (MMS), including narrowband assistance radio (NBA).
Texas Instruments
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Thanks to these new MCUs with the TinyEngine NPU, edge-based applications of AI acceleration can make consumer devices more intelligent and industrial devices more efficient.
Dreamstime_carloscaetano_31188634 and Cortec
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Cortec helps automakers and electronics manufacturers meet environmental packaging targets with VCI paper bags.
Rohde & Schwarz
Rohde & Schwarz demonstrates FR1–FR3 carrier aggregation, advancing 6G readiness.
Rohde & Schwarz and Qualcomm recently demonstrated carrier aggregation across the FR1 and FR3 frequency ranges.
STI-CO Industries
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With overmold designs that enhance mechanical robustness, STI-CO is making a push into military markets for its cable assemblies.