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Featured Products

Courtesy of Master Bond
MasterSil 981-LO
Master Bond MasterSil 981-LO is a two-component silicone designed for high performance bonding, sealing, and encapsulating applications. It does not require air for curing. The...
Courtesy of Mouser Electronics, Inc.
Mikroe LTE Cat.1 5 Click for Europe
Mikroe LTE Cat.1 5 Click for Europe features the Sequans GC02S1-EU2 3GPP LTE Release 14 Cat 1 bis-compliant module for 4G LTE cellular connectivity in European IoT, M2M, and consumer...
Courtesy of Mouser Electronics, Inc.
Mikroe LTE Cat.1 5 Click for North America
Mikroe LTE Cat.1 5 Click for North America is based on the Sequans GC02S1-NA2 3GPP LTE Release 14 Cat 1 bis-compliant module for 4G LTE cellular connectivity in North American...
Courtesy of Master Bond
EP64
Two component, vacuum compatible epoxy with convenient handling featuring outstanding temperature and chemical resistance Key Features ·      ...
Courtesy of Master Bond
EP6STC-80
One component, highly thermally conductive, silver filled epoxy, cures at 80-90°C Key Features Paste consistency Available in syringes and jars Unlimited working life, requires...
Courtesy of Mouser Electronics, Inc.
Digi Connect® Sensor XRT-M
Digi Connect® Sensor XRT-M provides a versatile solution for remote monitoring and implements Digi Axess. Digi Axess delivers the flexibility of the cloud and seamlessly...
Courtesy of Master Bond
UV26DCMed
Master Bond UV26DCMed is a dual-cure epoxy system designed for medical applications. It utilizes UV light for the initial cure and heat to fully polymerize areas not directly ...
Courtesy of Master Bond
EP54TC
Two part epoxy with high thermal conductivity, electrically insulating, and low thermal resistance for bonding and sealing.   Key Features Thermal conductivity exceeds 6...

Latest Products

Infineon
Infineon’s SECORA Connect X and SECORA Wallet.
Infineon’s SECORA Connect X and SECORA Wallet brings secured contactless payment to smart wearables.
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Advantech's AIW-411 Wi-Fi 6 + Bluetooth LE 5.4 wireless MCU module leverages the NXP RW612.
SCHURTER
SCHURTER SMT Half Pitch DIP Switches for Space-Critical Applications.
DTCD and DTCJ 1.27-mm-pitch DIP switches will significantly reduce footprint without compromising functionality.
Integra Technologies
Integra Technologies Introduces Industry-First Single-Device 10 kW High Voltage GaN/SiC Transistor for L-Band.
The first single high-voltage GaN/SiC 150-V transistor produces 10 kW of pulsed saturated output power in the L-band.
Anritsu
Anritsu Introduces ML2439A Power Meter with up to 4 Channels.
The ML2439A power meter from Anritsu delivers enhanced versatility and speed for power measurement applications.
ROHM Semiconductor
ROHM launches ESD protection diodes.
ROHM launches ESD protection diodes for high-speed interfaces exceeding 10 Gb/s, with low dynamic resistance and capacitance.
Samtec
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These small-form-factor, threaded interconnects are suited for military, aerospace, and communications applications.
Variscite
Variscite's VAR-SMARC-MX95 system-on-module is built on the NXP i.MX 95 applications processor.
Variscite's latest VAR-SMARC-MX95 SOM leverages the NXP i.MX 95 applications processor.
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MIKROE's ETH WIZ 3 Click provides Ethernet connectivity with integrated dual-core processing and hardware TCP/IP networking.
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Taiwan Semiconductor released 1,200-V-rated SiC Schottky diodes in the smaller SOD-128 package.
Signal Hound
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Multichannel I/Q analysis provides a powerful, integrated way to see and measure complex RF behaviors across multiple inputs.
Ranatec
Ranatec's high-performance RF2037 and RF2038 6- and 26.5-GHz switch boxes for RF applications.
Ranatec's high-performance switch boxes are aimed at RF applications in high-activity wireless infrastructure.