Computer-on-Module Family Accelerates Edge AI Deployment

New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.
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April 9, 2026
2 min read
congatec
A range of congatec modules supports computationally powerful, energy-efficient embedded AI applications.

A range of congatec modules supports computationally powerful, energy-efficient embedded AI applications.

Delivering up to 180 TOPS of power-efficient computation designed for AI acceleration, congatec's latest portfolio of computer-on-modules (COMs) leverages Intel Core Ultra Series 3 processors. The modules' high level of processing capability means discrete accelerator cards will not be necessary for embedded AI applications, suiting them for deployment in AI-driven applications.

Five new congatec COMs across four form factors use the advanced heterogeneous core architecture of Intel Core Ultra Series 3 processors They're targeted at local natural language processing (NLP), large-language-model (LLM) execution, image classification, sensor fusion, and simultaneous localization and mapping (SLAM). 

The modules provide up to 16 cores that reach up to 10 TOPS, with an integrated NPU5 for low-power AI inference with up to 50 TOPS. They can replace discrete AI accelerators with up to 12 Xe3 cores reaching ~120 TOPS.

Space-critical designs are best served with the COM Express Mini and COM-HPC Mini modules. Existing COM Express applications benefit from two COM Express Compact modules optimized for either ruggedness or cost. Applications requiring uncompromised performance and I/O bandwidth can use the new COM-HPC Client module.

Supported operating systems include Microsoft Windows 11, Windows 11 IoT Enterprise, ctrlX OS, Ubuntu Pro, Kontron OS, Linux, and Yocto. The COMs can be pre-configured with licensed ctrlX OS, Ubuntu Pro, and KontronOS.

An aReady.VT option with integrated hypervisor-on-module allows for the consolidation of multiple workloads, such as real-time control, HMI, AI, and IoT gateway functions on a single module. For IIoT connectivity, aReady.IOT software building blocks enable data exchange; maintenance/management of the module, carrier, and peripherals; and cloud connectivity upon request. 

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About the Author

Alix Paultre
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Alix Paultre

Editor-at-Large, Microwaves & RF

Alix is Editor-at-Large for Microwaves & RF. 

An Army veteran, Alix Paultre was a signals intelligence soldier on the East/West German border in the early ‘80s, and eventually wound up helping launch and run a publication on consumer electronics for the U.S. military stationed in Europe. Alix first began in this industry in 1998 at Electronic Products magazine, and since then has worked for a variety of publications, most recently as Editor-in-Chief of Power Systems Design.

Alix currently lives in Wiesbaden, Germany.