A high-speed microprocessor developed by Teledyne e2v Semiconductors promises to bring high-speed, high-capacity processing and networking to compact spacecraft for advanced computing during space missions.

The Model LX2160-Space microprocessor (see image above) employs error-correction-code (ECC) technology and two DDR4 memory interfaces operating to 3.2 GT/s. It builds on the firm’s 16-core, 64-bit Arm Cortex-A72 processor architecture, supporting wide-bandwidth, artificial-intelligence (AI) applications to 2.2 GHz including Earth observation, image processing, high-speed communications, and spacecraft avionics. 

The space-grade processor incorporates multiple PCIe Gen3 controllers, packet-processing acceleration, a 100-Gb/s data compression engine, and a 50-Gb/s security accelerator to provide Gigabit Ethernet service to 100 Gb/s. The device is available through multiple qualification processes to match multiple mission requirements, including NASA Levels 1, 2 and 3; ECSS Class 3; and Teledyne e2v’s X1 New Space grade qualification process.

Regarding the processor, Frédéric Devrière, marketing product manager for Teledyne e2v Semiconductors, said, “With LX2160-Space, spacecraft designers can process images onboard, support autonomous operation, and handle high-speed data, while choosing qualification options that fit their mission needs. They can also benefit from the full ecosystem around the LX2160.”

The device will be part of a demonstration at the Space Tech Expo Europe (Bremen, Germany) scheduled from November 17-19, 2026, in which multiple AI image-processing algorithms are running concurrently.