Upscreened Microprocessor Boosts Computing Power
For increased computing power in a smaller package, Teledyne e2v Semiconductors has qualified an upscreened version of its model LX2140 microprocessor for the most demanding aerospace and defense systems and equipment. The latest version of the microprocessor, model LX2160, features a 16-core Arm Cortex-A72 design that densely packs computing power into a compact housing to aid such applications as artificial intelligence (AI)-at-the-edge networks and single-board computers (SBCs).
The LX2160 provides an increase in computing power efficiency of 2.6 Ginstructions/W over the firm’s previous-generation, military-qualified processor (model LS1046). The boost in computing power enables faster switching and routing of data without adding size to a system.
The LX2160 integrates a 16-core, 64-bit ARM processor that can interface with peripherals operating at rates to 100 GbE (100 Gb/s) and perform data compression/decompression to 100 Gb/s and encryption to 50 Gb/s. It has a dual controller-area-network (CAN) interface as well as UART, SPI, and I²C interfaces for flexible interconnections. It suits a wide range of aerospace and defense systems, including for communications, electronic warfare (EW), and where edge computing is required.
The LX2160 comes in a miniature package measuring 40 × 40 mm (see image above). It's designed for reliable performance from –55 to +125°C.
According to Thomas Guillemain, Marketing and Business Development Manager of Digital Processing Solutions at Teledyne e2v, “The military qualification of NXP’s flagship LX2160 processor enables Teledyne e2v to deliver to our aerospace and defense customers the high performance needed for their compute-intensive applications.”
In support of space applications and requirements, he adds, “We are already working to generate a space-qualified version of the LX2160 for launch next year.” Samples of the military-qualified LX2160 processor are available upon request.
About the Author
Jack Browne
Technical Contributor
Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

