Alpha and Omega Semiconductor
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Sink and Source Protection Switches Serve USB Type-C EPR 3.1 Apps

March 16, 2023
The AOZ13937DI sink and AOZ15333DI source protection switches pave the way for USB Type-C EPR 3.1 designs delivering up to 140 W.

Check out our APEC 2023 digital magazine for more show coverage.

Alpha and Omega Semiconductor, in Booth #810 at APEC, will showcase a pair of sink and source switches that can increase the power-delivery capability of USB Type-C ports to 140 W, paving the way for Type-C extended power range (EPR) implementations.

The AOZ13937DI is equipped to handle 28-V Type-C sinking applications, while the AOZ15333DI is capable of Type-C sourcing apps. These new switches are suited for 28-V Type C EPR implementations in high-performance laptops, personal computers, monitors, docking stations, and other applications.

The AOZ13937DI features an ultra-low, 20-m resistance with soft-start, overvoltage, ideal-diode reverse-current, short-circuit, overcurrent, overtemperature, and ESD protections. It's designed to isolate and protect downstream components from abnormal VBUS voltage and current conditions. The ideal-diode, fast reverse-current protection allows multiple power paths to be connected in parallel without interference.

The AOZ15333DI companion source switch IC is capable of sourcing 5 V at 3 A while blocking up to 28 V. AOZ15333DI is UL 2367- and IEC 62368-1:2018 (3rd Edition)-certified as a current-limiting switch suited for Type-C sourcing applications. The device is protected against numerous fault conditions such as VIN overvoltage protection (OVP), startup short-circuit protection (SCP), overtemperature (OTP) protection, and it has a programmable ILIMIT pin.

The AOZ15333DI and AOZ13937DI are available in production quantities with a lead time of 16 weeks. The unit price in 1,000-piece quantities is $0.84 USD for the AOZ15333DI and $1.10 USD for the AOZ13937DI. AOS products are offered in packages with Pb-free plating and are RoHS-compliant.

Check out our APEC 2023 digital magazine for more show coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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