Hybrid FPC-to-Board Connector’s Shielding Wards Off EMI Issues
Hirose Electric has launched a hybrid flexible-printed-circuit (FPC)-to-board connector with a fully shielded design that blocks both radiation and incident magnetic fields for clear and reliable signal transmission. The compact BK35 series supports high-speed data transmission up to 40 Gb/s and RF signal transmission up to 40 GHz.
Featuring a 0.35-mm pitch, 2.2-mm depth, and 0.6-mm stacking height, the BK35 Series suits tight locations that are sensitive to radiation and/or electromagnetic interference (EMI), including smartphones, tablets and notebook PCs, wearable devices, and other compact electronic systems.
These connectors offer a hybrid design that combines power and signal contacts, reducing the number of connectors required on a PCB as well as bringing space and cost savings. With four power contacts rated at 2.5 A each, the BK35 Series delivers reliable power.
In addition, the BK35 Series has a robust, fully armored design for enhanced reliability and durability in demanding environments. The armor also protects against housing damage from misalignment during mating.
The FPC-to-board connector performs well up to 40 GHz and has low voltage-standing-wave ratios (VSWRs) of 1:1.3 maximum from 0 to 5 GHz and from 1:1.8 maximum from 20 to 40 GHz.
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David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.