Angled-Launch Connectors Conquer Cable Challenges in Testing mmWave PCBs
Some PCBs with mmWave RF signals can present tight mechanical constraints that make cable routing difficult or unreliable. Samtec’s 185-AL Series PCB-mount connectors aim to alleviate these issues by offering a 30° launch angle. They enable coaxial cables to exit the PCB at a natural angle, significantly reducing sharp cable bends that can degrade signal integrity.
These 1.85-mm connectors perform well through 67 GHz, solving common mechanical and routing issues found in dense mmWave lab test and evaluation scenarios. The solderless, compression-mount devices can be quickly mounted or unmounted from PCBs in the field, which reduces downtime and enables connector reuse. It also eliminates the performance variability that can result from inconsistent soldering practices.
Threaded coupling provides high mechanical reliability. Mating interconnects include Samtec’s high-performance microwave cable assemblies, such as 0.047-in.-diameter RF047-A Series cable, 0.086-in.-diameter RF086 Series cable, and Nitrowave LL071 Series cable. The latter’s optimized construction protects from measurement errors that can be induced by flexure.
Learn more about RF/microwave cables and connectors
About the Author
David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.