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    Check out the latest articles covering printed circuit board technology, methodologies and development tools.

    More content from PCB Tools and Technology

    Dreamstime_Audrius-Merfeldas_164118962
    Dreamstime Audrius Merfeldas 164118962
    The article shares some practical tips for dealing with issues like noise sensitivity and tight impedance margins when designing antennas for an RF PCB.
    Aug. 30, 2022
    Dreamstime_-Yury-Kosourov_11739262
    E Dpromo Tag
    SDR requires a complex web of circuity on PCBs that not only defines the device's functionality, but also the performance of these microwave and RF systems. Various factors come...
    July 5, 2022
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    What are the board-design considerations for building circuits targeting mmWave apps? This article highlights the main design issues and offers some tips and tricks to help you...
    Feb. 16, 2022
    11 Myths
    Today’s high-data-rate, high-frequency designs create new challenges for printed-circuit-board design.
    May 26, 2021
    Siemens EDA
    0421 Mw Siemens Eda Pc Bflow Promo
    Software enables secure collaboration between PCB designers and manufacturers; initial release includes instant DFM analysis.
    April 5, 2021
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    Sorting through the specifications helps when selecting a circuit material for microwave, millimeter-wave, and even high-speed-digital circuits.
    April 29, 2016
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    Sorting through different RF/microwave circuit materials educed comparisons of performance improvements and cost hikes, although some materials may save processing expenses.
    Aug. 3, 2015
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    Requirements are somewhat different for circuit materials supporting RF/microwave power amplifiers compared to materials for low-noise amplifiers.
    May 27, 2015
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    Circuit materials are available in a wide range of formulations that represent tradeoffs in price, performance, and fabrication difficulty for RF and microwave circuits.
    Oct. 29, 2013
    This photograph shows the microstructure of the highthermalconductivity aluminum diamond material used for heat sinks and in packages for highpower RFmicrowave devices such as GaN transistors Photo courtesy of Nano Materials International Corp
    Thermal management in high-frequency circuits depends on careful choice of circuit and packaging materials to remove heat and preserve high performance levels.
    April 3, 2013
    Understanding different characterization parameters related to temperature can help when selecting a printed-circuit-board material for high-power RF/microwave applications.
    May 18, 2011
    Kigen and Getty Images
    Getty Images 1397047849 Web
    These equations can be applied to a number of different substrate materials to estimate the relative dielectric constant of circuit boards with microstrip transmission lines. ...
    Dec. 11, 2007