One Stop for Boards and Connectors

Aug. 10, 2023
Amphenol Printed Circuits' Brian Guidi provides a high-level overview of the company's PCB and PCA products for the military, aerospace, and defense industries.

Recently, we had a chance to catch up with Brian Guidi, an applications engineer at Amphenol Printed Circuits. Brian gave us a brief overview of the company's product mix and capabilities.

Here's a transcript of the video (it has been edited for clarity):

Good afternoon, my name is Brian Guidi. I’m an applications engineer with Amphenol Printed Circuits out of Nashua, N.H., about an hour outside of Boston.

I’ve been with Amphenol since 2012. I’ve been in the industry and the printed-circuit-board industry since 1986. Amphenol, out of southern New Hampshire, manufactures all types of printed circuit boards and printed circuit assemblies, primarily for the military, aerospace, and defense industries.

Our product mix is about 50% rigid boards, and that encompasses backplanes, large form-factor backplanes, daughtercards, and RF rigid boards as well. The other 50% of our product is flex and rigid flex technologies.

So one of the things that makes Amphenol a little bit unique is we have the benefit of a very large corporation that has a variety of different components, connectors and, product types that can fill just about every need in an electronic system. There aren’t any other companies that have a board factory as large as Amphenol, but also have the benefit of a vast array of connectors, sensors, and wire harnessing that Amphenol has [available].

We leverage all those capabilities from all of our divisions around the world, in the military and aerospace organizations, to support our customers and their needs for advanced systems and printed circuit systems as well. Thank you.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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