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AirBolt Brings Advanced GPS Asset Tracking to Enterprise Level

Dec. 30, 2022

AirBolt debuts a new emphasis on enterprise-level asset tracking in addition to its established consumer and retail focuses.

David Maliniak

Related To: Microwaves & RF

Click for more CES 2023 coverage

At CES 2023, AirBolt is showing its GPS tracking technology and is featuring a new focus on enterprise-level asset tracking in addition to its established consumer customer base. Recently the company expanded its focus to enterprise channels next to direct-to-consumer pets, bikes, and travel segments, and continues to grow with new partners. “With a global asset-tracking market estimated at $55.1B by 2026, AirBolt is at the forefront of a rapidly expanding consumer and enterprise tracking market” said AirBolt’s head of partnerships, Jeff Pouliot.

AirBolt’s new product release coincides with a time when about $47 billion worth of items are lost each year, and most people spend nearly a year of their lifetime looking for misplaced or lost items. The company works with both retail and enterprise markets with solutions for both segments. At CES 2023, AirBolt will be exhibiting its technology at Booth 60101 in Tech West, Venetian Expo, Level 1.

Click for more CES 2023 coverage

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.