Puck Antennas Offer Compact Screw Mount for Metal Enclosures
The new MA58x family of compact, discrete, screw- or through-hole-mount antennas has joined the Comet Series of puck antennas from Taoglas. They’re intended to combat the effects on ground-plane and antenna performance of metal structures or flat surfaces like cabinets. The Comet MA58x Series maintains stable, high-efficiency operation in these challenging conditions.
Conventional LTE antennas rely on their RF cables to achieve low-band efficiency, particularly when the cable itself is routed inside a metal enclosure, turning it into an unintended radiator. The MA58x design removes this dependency, enabling efficient radiation and claiming to deliver at least 20% better performance than comparable alternatives.
The MA58x Series is suited to gateways and routers, public safety systems, point-of-sale terminals, digital signage, smart-home automation, robotics, and industrial automation. The Comet Series also offers a magnetic mount MA32x variant to address different deployment needs.
With a footprint of just 101 × 101 mm and a low profile of 20 mm, the antennas offer reliable multi-antenna connectivity across 4G/5G MIMO, Wi-Fi 6/7, and GNSS-constellation frequencies, including GPS, GLONASS, Galileo, and BeiDou. They deliver consistent gain and efficiency across global cellular frequencies from 600 MHz to 6 GHz and Wi-Fi bands up to 7.125 GHz, while also supporting legacy 2.4/5.8-GHz Wi-Fi and Bluetooth for maximum compatibility.
The rugged, weather-resistant housing is molded in acrylonitrile styrene acrylate (ASA) for long-term outdoor durability. Meanwhile, the IP67-rated enclosure with a screw/stud mount provides a permanent installation option that ensures secure, reliable operation in vibration-prone and harsh conditions such as fleet vehicles, heavy equipment, and industrial automation.
The new antennas are available now in multiple configurations and in either black or white enclosures. Custom cable lengths and connector options are also offered, making integration more flexible for OEMs and system designers.
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David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.