Smiths Interconnect Ims Promo 62b748e319604

RF Filter Solutions Address X, Ku, and Ka Band Applications

June 25, 2022

Leveraging thin-film process technology, these SMT filters slash lead times compared with custom designs.

At last week’s IMS2022, Smiths Interconnect launched its Planar X Series of thin-film bandpass filters designed for applications in harsh environments. The Planar X Series filters provide system engineers with a high-performance and compact solution for critical RF filtering in X, Ku, and Ka bands.

The Planar X Series leverages thin-film process technology on various substrates which are designed for mission-critical applications. The small-footprint, lightweight, and surface-mountable configuration allows for high-volume pick and place applications and is well suited for end products in the radar, SATCOM, and satellite industries. Planar X Series complements Smiths Interconnect's extensive portfolio of RF/Microwave components with an off-the-shelf product offering reduced lead times compared to custom-designed filters.

In addition to the standard products, Smiths Interconnect can provide custom Planar X filter designs to meet specific application requirements. Regardless of the application, Smiths Interconnect’s internal processes and procedures enable it provide filters that meet our customers’ specifications.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.