High-Pass, Thin-Film Filters Serve Space-Constrained Apps

Nov. 17, 2023

Offering reliable high-frequency performance, these miniature filters are primed for uses in telecom, automotive, consumer electronics, and military applications.

David Maliniak

The Overview

Kyocera AVX's HP Series of high-pass, thin-film filters offer reliable and repeatable performance as well as low insertion losses, very sharp roll-off values, and steep attenuation. Five part numbers are available in 0805-size packages.

Who Needs It & Why?

These thin-film filters are optimized for use on the small, densely populated PCBs typically designed for next-generation wireless applications. Because they're based on multilayer thin-film technology, the filters can be quickly adjusted by Kyocera AVX in terms of RF parameters, yielding custom filters with a short lead time.

Under the Hood

HP Series filters are offered in models optimized for 2.70, 2.80, 2.90, 3.00, and 5.15 GHz, enabling broad compatibility with high-frequency wireless systems, including 5G and UWB applications. Because the parts are rated at 15 W, they can also be deployed in high-power remote radio units in base stations as well as in defense applications.

Their overall operating frequency range is 1 to 5.15 GHz and they tolerate a broad temperature range of –40 to +85°C. Characteristic impedance is 50 Ω. The filters exhibit high temperature stability and lot-to-lot as well as part-to-part consistency. They also offer rugged, miniature, and low-profile construction that's suitable for automated assembly. Packages measure 2.03 mm long × 1.55 mm wide × 0.8 mm tall (±0.1 mm) and the parts offer a continuous power rating of 3 W.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.