Commercial

Highlights

Teledyne Space Imaging
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Three high-resolution image sensors have been tested and upscreened for monitoring the Earth from space.
Circuits Integrated Hellas (CIH)
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May 21, 2025
The chipset platform redefines satellite agility, efficiency, and sustainability through >60% reduction in size, weight, and cost of flat-panel antennas.
ID 310874325 © Pongsak Ray | Dreamstime.com
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May 1, 2025
The low-power wireless SoCs, which integrate Wi-Fi 7 with Bluetooth 6.0 and Zigbee/Thread, are compliant with the Matter protocol and can send/receive data on multiple frequency...
L3Harris | Generated by AI
Use of 3D printing has dramatically reduced the number of parts needed for the copper thrust chamber of the RL10 rocket engine.
Dec. 4, 2024
Use of 3D printing has dramatically reduced the number of parts needed for the copper thrust chamber of the RL10 rocket engine.
ID 319436273 © Atcharapun Samorn | Dreamstime.com
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Nov. 27, 2024
Electronic products enjoy the greatest benefits by combining RF/microwave functions with emerging technologies, such as AI/ML, cognitive radio, IoT, and Open RAN.
ID 136844444 © Modfos | Dreamstime.com
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Nov. 27, 2024
O-RAN technology stands poised to increase interoperability between equipment from disparate vendors even as it promotes lower latency, lower equipment costs, and higher system...
ID 204902784 © Nicoelnino | Dreamstime.com
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Nov. 27, 2024
Thanks to agencies like the DoD leading the way, IoT/IIoT cybersecurity is top of mind for network admins in 2025 and beyond.
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The article discusses the differences between IEEE 802.11af and 802.11ah standards, their applications in IoT, wireless backhaul, and how they address sub-1-GHz spectrum needs...
Filtronic
Filtronics' Hercules II E-band transceiver
Modules bring all the T/R functions of an E-band link and support spectrally efficient modulation schemes to underpin low-latency private networks.
80518278 © Avmedved | Dreamstime.com
Here's where you can find recaps of our coverage of this year's International Microwave Symposium.
Arctic Semiconductor
The all-in-one transceiver performs multi-stage upconversion and downconversion from RF to digital and vice versa from 600 MHz to 7.2 GHz.