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News

Wide-Bandgap Tech Forms Basis for RF Switches, LNAs, PAs

June 11, 2025

TagoreTech’s GaAs LNAs, GaN switches, and integrated modules deliver on performance and integration benefits.

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Browse our complete IMS 2025 coverage.

At IMS 2025, visit TagoreTech in Booth #332 to see the latest in the company’s lineups of gallium-arsenide (GaAs) low-noise amplifiers (LNAs), 2nd-generation gallium-nitride (GaN)-based RF switches, MCM switches/LNA modules, and GaN power amplifiers.

The company’s products, based largely on its work in GaN and wide-bandgap semiconductor technologies, help drive innovation and integration in high-reliability, high-frequency applications. Tagore’s proprietary solutions aid in reducing system complexity, size, and power consumption across a broad range of applications—from 5G infrastructure to consumer electronics, automotive, defense, and public-safety systems.

Its lineup of 2nd-generation GaN RF switches and hybrid modules are intended to facilitate high-power system design. The devices assist designers in efforts to achieve high switching performance, low noise figures, and high integration densities in their RF front-end architectures.

At IMS, Tagore’s CTO, Manish Shah, will present “GaN-Si-Based RF Switch to Improve SWaP and Reduce Complexity Out of High-Power Radio Design” on June 16, 2025, at 10:40 am (local time), location 215.

Learn more about wide-bandgap technologies

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GaN Enables RF Where LDMOS And GaAs Can't

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.