Digital Signal Transceiver Eases Test of Mixed-Signal DUTs

Sept. 18, 2025
In a showcase of its DST, NI/Emerson displays a means of testing SDRs, digital T/R modules, and other mixed-signal devices in a manner evoking test of traditional RF-only DUTs.

National Instruments (now a part of Emerson) has long been a creative force in RF-related test technologies. The company’s prowess was recently demonstrated again in the form of its Digital Signal Transceiver (DST), which enables users to test mixed-signal devices (RF combined with high-speed serial data) in a way much akin to how pure RF devices have long been tested.

A recent demonstration of the test setup (described below and in the accompanying video) was a powerful showing of how the technologies might be applied to the test of a range of mixed-signal devices. These can include things like digital transmit/receive modules, software-defined radios (SDRs), and satellite communication gear.

The Digital Signal Transceiver provides a means to examine a device under test (DUT) that has both analog and digital I/Os. A recent demonstration of the DST included NI’s Ettus X410 SDR as a simulated mixed-signal DUT. This SDR has both analog and digital ports as well as a QSFP28 port.

The demo also included DST software running on a PXIe-7903 Flex-RIO Coprocessor to generate and analyze high-speed serial (HSS) signals as well as a PXIe-5842 Vector Signal Transceiver (VST) to generate and analyze RF signals. The demo highlighted RF signal generation on the Vector Signal Transceiver and HSS capture/analysis on the DST, as well as HSS generation on the DST and RF signal analysis on the VST.

David Maliniak | Executive Editor, Microwaves & RF
About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.

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