200-W Smart Amplifier Module Fuels Critical c-UAS and EW Apps
Today’s electronic-warfare and counter-unmanned aerial systems (c-UAS) deployments require reliable RF power amplifiers that meet the needs of mobile, airborne, shipboard, and ground-based defense platforms. Empower RF Systems' Model 1240, a compact, high-performance RF amplifier module, delivers a guaranteed minimum of 200 W across the 900- to 1,700-MHz frequency range.
The Model 1240 is a full-gain “smart module” built on advanced gallium-nitride (GaN) transistor technology, integrating comprehensive control and monitoring features to ensure consistent RF performance under all environmental conditions. Its compact form factor and high power density make it well-suited for mobile, airborne, shipboard, and ground-based defense platforms where space, weight, and reliability are critical.
A key aspect of the Model 1240 is its strategically targeted frequency coverage. The amplifier’s range of 900 to 1,700 MHz aligns directly with operationally significant bands used in modern communications, navigation, and drone-control systems.
For example, the 900-MHz band and adjacent ranges are widely used in GSM and cellular communications, while GPS and GNSS systems operate within the L-band (1 to 2 GHz). In addition, the 900-MHz ISM band is commonly used for long-range drone command links and video transmission.
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David Maliniak
Executive Editor, Microwaves & RF
I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.
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About me:
In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.