Thread Border Router Supports Multiple IoT Protocols

Dec. 29, 2022

This miniaturized Thread gateway supports BLE 5.0 protocol as well as cloud device management while running a customizable OpenWrt OS.

David Maliniak

Related To: Microwaves & RF

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At CES 2023, GL.iNet will display its GL-S200 Thread border router, a miniature and versatile device for connecting to various smart-home devices, or for mass device connectivity in smart buildings. Supporting both device-to-device and device-to-cloud links, the router’s built-in Thread protocol allows deployment of multiple border routers seeking the most efficient path using the fewest nodes for internet connectivity.

The GL-S200 represents a future-proof smart-home gateway for home automation, supporting the Thread, BLE 5.0, and Wi-Fi 802.11b/n/g protocols. It delivers Wi-Fi data transfer rates up to 150 Mb/s and supports 10/100-Mb/s Ethernet.

At the heart of the GL-S200 is OpenWrt, an open-source operating system based on Linux. The OS lets users optimize device performance for specific use cases, or tailor the firmware for particular requirements. The device also comes with GoodCloud, a cloud device management platform for remote device access, batch firmware upgrades, and network analytics.

Visit GL.iNet at CES 2023 in the Venetian Expo, Level 2 - Booth 55344.

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About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.