True Circuits Opens Its Simulation Environment to the Public

July 7, 2023

The company's JSPICE software, used for 25 years in-house to make its own PLL and DLL IP, is now available through a beta test in advance of a commercial release.

David Maliniak

Related To: Microwaves & RF

This article is part of our Design Automation Conference 2023 coverage.

True Circuits (TCI) has long made use of its JSPICE simulation and design environment to create its general-purpose analog and synthesizable phase-locked-loop (PLL) and delay-locked-loop (DLL) intellectual property (IP). To mark its 25^th year of operation, the JSPICE software is being made available to the public through a beta test in preparation for a commercial release.

As TCI began in 1988, it started with a family of standardized timing IP to cover a variety of chip applications, offering customization to address existing legacy requirements. At that time, the company decided to develop many of its own CAD tools to eventually automate all aspects of the design flow.

The result, as it stands today, is the JSPICE environment, which supports many IP design types (PLLs, DLLs, and DDR PHYs), all major foundries, and most IDM processes and process variants, as well as hundreds of semiconductor customers and design partners from 250 to 4 nm. JSPICE greatly simplifies and speeds up the process of designing and characterizing complex analog and digital circuits by dramatically facilitating and enhancing the process of running simulations and interpreting their results.

For more information, visit the company's website

For more Design Automation Conference 2023 coverage, visit our digital magazine.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.