Space-Qualified Fixed Chip Attenuators Optimize Return Losses Over Multiple Frequency Ranges

These broadband attenuators operate up to 50 GHz, offering high attenuation accuracy and reduced design footprints, simplifying integration in mission-critical systems.

David Maliniak

Related To:

Microwaves & RF

Oct. 30, 2025

Key Highlights

Provides broadband performance up to 50 GHz with high power handling in a small 0404 wire-bond package.
Designed to reduce component count and save space in aerospace, space, and defense applications.
Built with thin-film technology on alumina, ensuring high reliability and compliance with MIL-PRF-55342 standards.
Available in multiple attenuation values from 1 to 20 dB, with power handling up to 1 W.

6903907faf03ade0ecb5694f 1025mwrf Smiths Interconnect Tsx Wb2 Promo

Smiths Interconnect launched a new series of space-qualified, high-reliability fixed chip attenuators that are optimized to provide both high-frequency performance and high power-handling capability in a small package. The HR TSX Wire Bond 2 Series meets increasing challenges in the domains of space, power, and performance.

These attenuators offer broadband performance up to 50 GHz while handling more power in a 0404 wire-bond package. They allow wider coverage than traditional components while providing optimized return loss for multiple frequency ranges.

As a result, these devices fit into many applications and may reduce the need to purchase multiple components. In addition, they deliver high attenuation accuracy and reduce overall design footprints to save space in mission-critical applications.

Built with a thin-film technology on an alumina substrate, the HR TSX WB2 attenuators suit applications in aerospace, space, and defense. They eliminate the need for costly and time-consuming drawings and specifications as they already meet the specification and testing requirements of MIL-PRF-55342.

Devices are available in multiple attenuation values of 1 to 10 dB, 15 dB, and 20 dB, and with power handling of up to 1 W.

About the Author

David Maliniak

Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our contributor's packet, in which you'll find an article template and lots more useful information on how to properly prepare content for us, and send to me along with a signed release form.

About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.