This article is part of our IMS2022 coverage.
Visit Indium Corporation in its IMS2022 Booth 9012, where it will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications. Au-based alloys are known for high performance and reliability in applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product.
For critical, high-reliability die-attach applications, Indium Corp.'s Au-based PDA preforms deliver features that include:
- Highly accurate thickness control
- Precision edge quality, virtually burr-free
- Optimized cleanliness control
- Default waffle-pack method
The company's AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.
AuSn preform products deliver improved wetting and voiding. They allow for adjustment of the final solder-joint composition and are available in 78Au22Sn and 79Au21Sn formulations.
For more information, visit the product webpage.
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