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Among several CES 2023 launches, TDK Corporation is unveiling its TDK i3 Micro Module, claimed as the world’s first module with built-in edge AI and wireless mesh connectivity capability. Through TDK’s collaboration with Texas Instruments (TI), the i3 Micro Module integrates the TI SimpleLink platform, which features the CC2652R7, an Arm Cortex-M4F multiprotocol 2.4-GHz wireless 32-bit microcontroller (MCU) for real-time monitoring.
The new module also integrates TDK’s IIM-42352 high-performance SmartIndustrial MEMS accelerometer and digital output temperature sensor, edge AI, and mesh network functionality into a single unit, facilitating data aggregation, integration, and processing.
The i3 Micro Module’s ultra-compact, battery-powered, wireless sensor enables users to achieve sensing at most any desired position without physical constraints like wiring. This dramatically expedites the prediction of anomalies in machinery and equipment, enabling an ideal condition-based monitoring (CbM) implementation.
Monitoring through real-time visualized empirical equipment data instead of relying on manpower and scheduled maintenance, understanding the health of machinery and equipment to help extend utilization life, and minimizing production downtime by preventing unexpected failures—all contribute to establishing an ideal predictive maintenance system. TDK designed the i3 Micro Module for truly “smart” sensor-node edge implementation aimed at a wide variety of production equipment, empowering the ongoing global evolution toward smart factories.
The i3 Micro Module solution is expected to be available through most global distribution partners by the fourth quarter of 2023. See a demo at TDK’s booth #16181 at the Consumer Electronics Show, January 5-8, 2023, in Las Vegas, Nevada, USA.
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