An ongoing collaboration between Airspan Networks and ON Semiconductor will capitalize on the latter’s QCS-AX family of Wi-Fi 6 chipsets to augment the reliability and scalability of the former’s fixed wireless-access (FWA) deployments. Airspan’s FWA sites provide mobile operators with high-reliability public and private Wi-Fi access in urban, suburban, and rural settings.
Powered by the ON Semi chipsets, Airspan’s next-generation products will maximize the benefits of the new Wi-Fi 6 standard, including the additional spectrum in the 6-GHz band. The OFDMA-based, 8x8 beamforming technology will significantly improve noise immunity while enabling high-spectral efficiency and delivering multi-gigabit capacities, benefiting from the 160-MHz channels with modulation rates of 1024 QAM.
This collective effort enables Airspan to augment the reliability and scalability for outdoor and FWA deployments using the ON Semiconductor’s Wi-Fi 6 chipsets. Next-generation Airspan products currently under development will address market demand for high spectral efficiency, interference immunity, and network orchestration capabilities for seamless carrier-grade deployments. FWA demands continue to advance where capacity and reliability are critical for day-to-day use in schools, hospitals, law enforcement, and for economic growth.