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Airspan Banks on ON Semi’s Wi-Fi 6 Chipsets for Fixed Wireless Access Applications

July 9, 2020

ON Semiconductor’s QCS-AX Wi-Fi 6 chipsets bring reliability and scalability to Airspan’s next-generation FWAs

An ongoing collaboration between Airspan Networks and ON Semiconductor will capitalize on the latter’s QCS-AX family of Wi-Fi 6 chipsets to augment the reliability and scalability of the former’s fixed wireless-access (FWA) deployments. Airspan’s FWA sites provide mobile operators with high-reliability public and private Wi-Fi access in urban, suburban, and rural settings.

Powered by the ON Semi chipsets, Airspan’s next-generation products will maximize the benefits of the new Wi-Fi 6 standard, including the additional spectrum in the 6-GHz band. The OFDMA-based, 8x8 beamforming technology will significantly improve noise immunity while enabling high-spectral efficiency and delivering multi-gigabit capacities, benefiting from the 160-MHz channels with modulation rates of 1024 QAM.

This collective effort enables Airspan to augment the reliability and scalability for outdoor and FWA deployments using the ON Semiconductor’s Wi-Fi 6 chipsets. Next-generation Airspan products currently under development will address market demand for high spectral efficiency, interference immunity, and network orchestration capabilities for seamless carrier-grade deployments. FWA demands continue to advance where capacity and reliability are critical for day-to-day use in schools, hospitals, law enforcement, and for economic growth.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.